Automated X-Ray Inspection
(AXI)
TR7600F3D SII
INTRODUCTION
The TR7600F3D SII is the Next-generation High-Speed In-line Automated X-Ray Inspection Solution, soaring speeds as to twice to three times as fast as the previous model. The AXI solution can inspect large boards, up to 900 mm x 460 mm. The TR7600F3D SII lowers the escapes and false calls without compromising the production line’s cycle time.
Features
- 5 µm High Precision for Comprehensive Defect Detection
• Next Generation Mechanical Design for Higher Speedup to 10 FOV/s
• Smart Factory Ready with Easy MES Connectivity
TR7600TL SIII
INTRODUCTION
The TR7600TL SIII is the new Inline line scan 3D AXI, with CT capabilities specialized, designed for the inspection of larger board sizes, up to 1200mm x 660mm. The TR7600TL SIII Series platform delivers exceptional speed and performance without compromising imaging resolution.
Features
- Ultra-High Speed 3D CT X-Ray Inspection
•Ultimate Resolution AXI for Large Boards
• Smart Programming with Robust Algorithms
TR7600LL SIII
INTRODUCTION
The TR7600LL SIII series CT AXI is a new generation of TRI’s hallmark inline PCBA inspection solutions. Designed for 100% inspection coverage of very large boards, the TR7600LL SIII delivers industry’s fastest high resolution imaging performance and great image quality in the industry’s most advanced automatic X-ray inspection.
Features
- Ultra-high Speed 3D CT X-Ray Inspection
- Excellent Image Quality
- True 3D Solder Joint Viewer
- Extra Large Board Inspection
- High Resolution for 01005in Chips
TR7600 SIII
INTRODUCTION
The TR7600 SIII series CT AXI is a new generation of TRI’s hallmark inline PCBA inspection solutions. Designed for 100% inspection coverage at production line speed, the TR7600 SIII combines industry’s fastest high resolution imaging speed with greatly improved image quality in the industry’s most advanced automatic X-ray inspection.
Features
- Ultra-high Speed 3D CT X-Ray Inspection
• Excellent Image Quality
• True 3D Solder Joint Viewer
• High Resolution for 01005in Chips
TR7600XLL SII CT
INTRODUCTION
TR7600XLL SII CT is high performance and high speed 3D AXI for the largest server, networking and power PCBs. The TR7600XLL SII system uses TRI’s unique shadow-free technology to inspect multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs and Press-fit connectors. Smart programming assistants and multi-resolution programs help maximize production yields on any production line. TRI’s Planar CT technology brings true 3D solder joint review for maximum inspection accuracy.
Features
- Very Large board edge to edge inspection up to 1000 mm x 660 mm
•Automated programming saves hours of engineer workload
• Multi resolution programs and advanced processing for superior image quality
• Automatic 2D + 3D slice image extraction using Digital Tomosynthesis
• X-ray tube with adjustable output up to 130 kV/300 µA
• Planar CT Imaging for True 3D Solder Review
TR7600XLL SII
INTRODUCTION
TR7600XLL SII is high performance and high speed 3D AXI for the largest server, networking and power PCBs. The TR7600XLL SII systems uses TRI’s unique shadow-free technology to inspect multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs and Press-fit connectors. Smart programming assistants and multi-resolution programs help maximize production yields on any production line.
Features
- Very Large board edge to edge inspection up to 1000 mm x 660 mm
• Automated programming saves hours of engineer workload
• Multi resolution programs and advanced processing for superior image quality
• Automatic 2D + 3D slice image extraction using Digital Tomosynthesis
• X-ray tube with adjustable output up to 130 kV/300 µA
TR7600X SII CT SII
INTRODUCTION
Built for maximum inspection performance, TR7600X SII CT series offers ultimate performance 3D X-ray inspection for the largest server, networking and power PCBs. With advanced ultra-high-speed cameras, the TR7600X SII CT series combines TRI’s unique shadow-free 3D inspection of multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs, Press-fit connectors with fully automated programming and multi-resolution programs help maximize production yields on any production line. TRI’s Planar CT technology brings true 3D solder joint review for maximum inspection accuracy.
Features
- Ultra-high-speed bidirectional cameras
- Large board edge to edge inspection up to 900 mm x 460 mm
- X-ray tube with adjustable output up to 130 kV/300 µA
- Multi resolution BlockScan programs and advanced processing for superior image quality
- Automatic 2D + 3D slice image extraction using Digital Tomosynthesis
- Exclusive Image enhancement technology for clear Pressfit inspection
• Planar CT Imaging for True 3D Solder Review
TR7600X SII
INTRODUCTION
Built for maximum inspection performance, TR7600X SII series offers ultimate performance 3D X-ray inspection for the largest server, networking and power PCBs. With advanced ultra-high-speed cameras, the TR7600X SII series combines TRI’s unique shadow-free 3D inspection of multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs, Press-fit connectors with fully automated programming and multi-resolution programs help maximize production yields on any production line.
Features
- Ultra-high-speed bidirectional cameras
- Large board edge to edge inspection up to 900 mm x 460 mm
- X-ray tube with adjustable output up to 130 kV/300 µA
- Multi resolution BlockScan programs and advanced processing for superior image quality
- Automatic 2D + 3D slice image extraction using Digital Tomosynthesis
- Exclusive Image enhancement technology for clear Pressfit inspection
TR7600F2D
INTRODUCTION
TR7600F2D is a high performance inline 2.5D AXI specialized for single layer PCB and FPCB assemblies requiring highest image quality. Ideal for mobile electronics applications, the TR7600F2D can reliably detect microscopic voids, 01005 solder defects, and many QFN and BGA problems. Combining a fully automated programming and multi-resolution programs help maximize production yields on any production line.
Features
- Ultra-high-resolution edge to edge inspection up to 900 mm x 460 mm
• Automated programming saves hours of engineer workload
• Multi resolution programs and advanced processing for superior image quality
• 2D and off-axis imaging for shadow-free inspection
• X-ray tube with adjustable output up to 130 kV/300 µA